Huawei, the world's leading provider of information and communication solutions, announced today that the world's first 3G module, Huawei MU736, that fully meets the NGFF interface specification for next-generation mobile cards has been successfully released.
Huawei MU736 is the world's first WWAN module that fully meets the NGFF interface specification, based on Intel's industry-leading XMM 6260 HSPA+ communication chip solution. Intel provides the performance optimization of the ultrabook Shark Bay platform and MU736 to better meet the characteristics of ultra-low power consumption and ultra-long standby. Not only that, the product is also thinner and lighter. Its ultra-low power consumption and support for global UMTS Leading features such as 5-band global roaming on the network will also become the first choice of global PC manufacturers.
With the advancement of science and technology, users' demand for thinner and lighter digital products is also increasing. The past mobile card standards can no longer meet the needs of new generation products. Therefore, NGFF came into being. As a new physical interface specification, the NGFF interface will become an ultrabook. and the standard interface for products such as tablet computers in the future. Compared with the previous Mini PCI-e card, the next-generation mobile card represented by NGFF is smaller in size, can carry newer functions, and is more flexible on the bus. Because of its greater flexibility, OEM manufacturers can use greater imagination to make more innovative products. Among the ultrabooks and tablet PC products that will be launched in the future, Huawei MU736 will play a big role, thus leading the new trend of light and thin digital products in the world.
Horst Pratsch, Director of Intel Modules and M2M Product Solutions, said, "Intel is delighted to partner with Huawei to bring the world's first 3G NGFF module that provides global roaming, high performance, and optimal user experience. Intel is the world's leading HSPA+ A solution provider with an excellent all-in-one Intel computing platform will effectively promote the global expansion of Huawei MU736."
He Jinjun, Head of Huawei M2M Solutions, mentioned, "Huawei and Intel's cooperation in NGFF modules will help promote the rapid development of the ultrabook industry chain. Huawei has a global technical support platform with global certification and operator access advantages. Huawei MU736 It can help PC suppliers to speed up the time to market and expand the global market quickly."
It is no secret that Intel will launch a 22nm process Atom processor code-named Bay Trail-T in September. VR-Zone broke the news today that its specific release time is September 11, and it is also exposed with the first batch. Detailed specifications of the four models.
Intel will launch four 22nm Atom processors in the first batch, the models are Z3770, Z3770D, Z3740 and Z3740D (Is it time for the i7-3770 to cry?), these four products are all quad-core designs with a 2MB L2 cache. The integrated HD Graphics core graphics card is theoretically much stronger than the previous PowerVR SGX545.
Both Z3770/Z3740 processors support dual-channel LPDDR3-1067MHz memory, the maximum capacity is 4GB, the bandwidth can reach 17.1GB/s, the minimum supported resolution is 1366×768, and the maximum is 2560×1600. sDP) is 2W, TDP is unknown, the former has a maximum frequency of 2.4GHz, and the latter is 1.8GHz.
Z3770D/3740D can only support single-channel DDR3L-RS-1333MHz memory, the maximum is 2GB, the actual bandwidth is only 10.6GB/s, the minimum supported resolution is 1366×768, and the maximum is only 1920×1200. The scene design power consumption (sDP) is 2.2-2.4W, the highest frequency of the former is still 2.4GHz, and the latter is 1.8GHz.
These four processors are not integrated with baseband chips, and 3G/LTE must be used through third-party chips. VR-Zone found in the data that Intel will use two chips from Huawei, among which ME906v can provide LTE (LTE FDD B1/ B2/B4/B5/B8/B13/B17), while MU736 can provide support for 3G network, both of which use M.2 interface.
In terms of operating system, the Bay Trail-T platform will be the first to support Windows 8.1, and Android should wait for a while to support it.
It is no secret that Intel will launch a 22nm process Atom processor code-named Bay Trail-T in September. VR-Zone broke the news today that its specific release time is September 11, and it is also exposed with the first batch. Detailed specifications of the four models.
Intel will launch four 22nm Atom processors in the first batch, the models are Z3770, Z3770D, Z3740 and Z3740D (Is it time for the i7-3770 to cry?), these four products are all quad-core designs with a 2MB L2 cache. The integrated HD Graphics core graphics card is theoretically much stronger than the previous PowerVR SGX545.
Both Z3770/Z3740 processors support dual-channel LPDDR3-1067MHz memory, the maximum capacity is 4GB, the bandwidth can reach 17.1GB/s, the minimum supported resolution is 1366×768, and the maximum is 2560×1600. sDP) is 2W, TDP is unknown, the former has a maximum frequency of 2.4GHz, and the latter is 1.8GHz.
Z3770D/3740D can only support single-channel DDR3L-RS-1333MHz memory, the maximum is 2GB, the actual bandwidth is only 10.6GB/s, the minimum supported resolution is 1366×768, and the maximum is only 1920×1200. The scene design power consumption (sDP) is 2.2-2.4W, the highest frequency of the former is still 2.4GHz, and the latter is 1.8GHz.
These four processors are not integrated with baseband chips, and 3G/LTE must be used through third-party chips. VR-Zone found in the data that Intel will use two chips from Huawei, among which ME906v can provide LTE (LTE FDD B1/ B2/B4/B5/B8/B13/B17), while MU736 can provide support for 3G network, both of which use M.2 interface.
In terms of operating system, the Bay Trail-T platform will be the first to support Windows 8.1, and Android should wait for a while to support it.